May 5, 2011 -- In today's TechBytes: a significant development in computer chip design. Intel has unveiled a three-dimensional chip with a vertical fin-like structure, allowing more computing power but using less battery power. It could mean faster smartphones, lighter laptops and a new generation of supercomputers.
If you're planning a family vacation this summer, then you will likely be packing lots of devices, from smartphones and tablets to e-readers and portable gaming systems. Along with those, Sam Grobart, who writes the Gadgetwise blog for the New York Times, recommends that you bring along the powerstick as well.
"It's about the size of a USB thumb drive and it has these attachable connectors. So instead of having to carry all the different charging cables with you for all your other devices, you carry this one thing and it works with all your other devices. And again, it's about the size of like, a pack of gum," said Grobart.